Custom Oxygen Free Copper Plate Manufacturer & Exporter

High-Purity Oxygen-Free High-Conductivity (OFHC) Copper Plates Tailored to Meet Strict Aerospace, Semiconductor, 5G, and Electric Vehicle Standards Globally.

Global Industrial Status of Oxygen Free Copper Plates

In today's advanced manufacturing landscape, the demands placed on electronic, electrical, and structural materials are higher than ever before. Oxygen-Free Copper (OFC) and Oxygen-Free High Conductivity (OFHC) copper alloys represent the peak of metallurgical processing. Classified under standard designations such as UNS C10100 (99.99% pure copper with less than 0.0005% oxygen content) and UNS C10200 (99.95% pure copper with less than 0.001% oxygen content), these materials are highly sought after globally for applications requiring exceptional electrical and thermal conductivity combined with immunity to hydrogen embrittlement.

Unlike standard electrolytic tough pitch (ETP) copper, oxygen-free copper plates are melted and cast in a strictly controlled vacuum or carbon-monoxide-protected atmosphere. This meticulous environment prevents atmospheric gases from dissolving into the liquid copper. The removal of oxygen eliminates the formation of cuprous oxide at the grain boundaries, which can cause cracking and catastrophic mechanical failure during subsequent high-temperature processes such as brazing and welding.

Globally, the market is witnessing a major transition. Advanced semiconductors, vacuum electronics, space technology, high-power radar installations, and ultra-precise physics laboratory machinery (like particle accelerators) cannot operate without custom oxygen-free copper plates. As engineering tolerances shrink and system powers increase, the purity and mechanical homogeneity of the copper plates become the deciding factor in system reliability.

Industrial Oxygen Free Copper Plates Processing

About Sichuan Kepai New Material Co., Ltd.

Driving technological upgrading and sustainable development in the advanced metallurgy sector since 2017.

Established in 2017, Sichuan Kepai New Materials Co., Ltd. is a state-recognized high-tech enterprise that seamlessly integrates R&D, advanced manufacturing, and global sales. Our state-of-the-art facility covers an expansive area of approximately 9,000 square meters, supported by a 1,000-square-meter cutting-edge R&D and office headquarters. We are strategically focused on research, development, and manufacturing of strategic emerging new materials aligned with national high-tech manufacturing directives.

Our product portfolio specializes in high-end copper alloys, featuring custom high-purity oxygen-free copper, tellurium copper (famous for its high conductivity and ease of machining), silver copper, and dispersion strengthened copper. We focus heavily on applications in next-generation industries including electric vehicles (EVs), 5G telecommunication networks, high-power industrial laser cutting, and advanced lithium battery relays.

2017
Company Established
9,000㎡
Factory Footprint
1,000㎡
R&D and Office Headquarters

China Factory Efficiency & Logistics Advantages

Why leading global corporations source their custom oxygen-free copper plates from Sichuan Kepai.

Unmatched Supply Chain Integration

Located in the western industrial hub of Sichuan Guanghan Industrial Development Zone, we are backed by China's extensive metallurgical supply chain. From high-grade raw copper cathodes to alloy stabilizers, our material sourcing is instantaneous, ensuring continuous production runs without delay.

Strategic Geographical Logistics

Adjacent directly to National Highway 108, our factory benefits from rapid-response transportation nodes. We can coordinate swift freight dispatch to major dry ports and shipping hubs, reducing international delivery lead times by up to 25% compared to inland factories.

Advanced Process Control

By pairing skilled operators with automated high-speed extrusion and cold-drawing lines, Kepai balances high productivity with extreme tolerance control. We guarantee plate thickness tolerances up to +/-0.05mm, which drastically reduces material waste during custom machining.

Localized Application Scenarios of OFHC Plates

From aerospace vacuum systems to smart energy grids, oxygen-free copper plates are indispensable.

New Energy Vehicles (EVs)

Oxygen-free copper plates are sliced and machined into heavy-duty battery busbars, high-conductivity connector terminals, and inverter modules. The low resistance prevents excessive thermal buildup during rapid charging.

5G & Telecom Networks

Used heavily in high-frequency signal transmitters, power amplifiers, and RF shielding. The lack of impurities reduces signal attenuation, enabling higher bandwidth and stable long-range signals.

Precision Laser Cutting

Laser cutting head nozzles and reflecting mirror bases demand highly uniform heat dissipation. C10100 plates ensure localized heat is dispersed immediately, avoiding distortion and preserving laser path accuracy.

Lithium Battery Relays

Hermetically sealed relays require oxygen-free copper leads to maintain vacuum seal integrity over years of operations, preventing oxygen leaks that compromise volatile battery systems.

Company Strength & Technological Capabilities

Combining expert engineering with robust product systems to dominate regional and international markets.

Technical Strength

Our research and development and production team is composed of senior industry experts who keep pace with international cutting-edge technology trends. Through independent research and university collaborations, Kepai has made breakthroughs in high-performance copper alloys, reaching international standards.

Product System

Our rich catalog covers custom formulations including pure copper, oxygen-free copper, tellurium copper, nickel tellurium copper, beryllium copper, tin bronze, lead bronze, and chromium zirconium copper. We lower customer production costs while elevating final component reliability.

Market Layout

Adhering to the strategy of "rooted in Sichuan, radiating nationwide, and moving towards the world," Kepai has developed long-term collaborative partnerships with global leaders in Germany, the USA, Japan, and Southeast Asia, continually building brand presence worldwide.

Corporate Culture

We believe in "integrity, innovation, collaboration, and win-win." By investing in continuous human resource development and technical cross-training, we create an open, creative atmosphere that translates directly into high-quality copper solutions.

Advanced Equipment and Quality Infrastructure

From smelting to non-destructive testing, our fully integrated plant guarantees ASTM compliance.

Smelting

Smelting Furnace

laying-off

Laying-off Processing

extrusion

Extrusion Unit

drawing

Drawing Lines

straightening

Straightening Bench

package

Packaging Section

eddy current conductance instrument

Eddy Current Conductance tester

Chemical composition test room

Chemical Composition Testing

Metallographic sample polishing machine

Metallographic Polishing

Microcomputer controlled electro-hydraulic servo universal testing machine

Electro-Hydraulic Servo Tester

Liquid crystal display electronic universal testing machine

LCD Universal Testing Machine

Hardness tester

Digital Hardness Tester

International Certifications & Quality Approvals

Our adherence to ISO 9001 and high environmental standards ensures complete compliance and reliability.

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Future Trends in Oxygen Free Copper Manufacturing

How emerging technologies shape the metallurgical expectations for high-purity copper plates.

As advanced technology evolves, the metallurgical sector is entering a phase characterized by three major trends:

  1. Ultra-High Purity Copper (UHP-Cu): Modern electronic devices, quantum computing systems, and superconducting magnets demand copper plates with purity exceeding 99.999% (5N) or even 99.9999% (6N). Minimizing trace element residues (such as lead, sulfur, and bismuth) is critical to prevent microscopic resistance fluctuations at extreme cold (cryogenic) temperatures.
  2. Micro-alloying Integration: Additives such as trace amounts of Tellurium (Te), Zirconium (Zr), or Silver (Ag) are strategically alloyed with oxygen-free copper. This produces materials that retain high electrical conductivity (typically above 95% IACS) while vastly improving tensile strength and machinability. Our product line actively exploits this trend.
  3. Green and Sustainable Smelting: Global regulations are pushing manufacturers to reduce carbon footprints. Sichuan Kepai is addressing this challenge by upgrading induction smelting furnaces to achieve energy savings of over 15% and using secondary refining techniques that reduce raw ore dependency without compromising metallurgical purity.
High Quality Copper Plates Inspection

Global Sourcing Guide for Oxygen Free Copper Plates

Procurement managers and industrial engineers sourcing oxygen-free copper plates face strict challenges. Quality control extends far beyond visual surface inspections. To secure high-reliability components, verify the following details:

  • Oxygen and Purity Certification: Ensure the factory provides Mill Test Certificates (MTC) proving oxygen levels remain below 10 ppm (parts per million).
  • Hydrogen Embrittlement Testing: According to ASTM B170 and related global standards, the material must pass a bend-test after being heated in a hydrogen atmosphere. This guarantees the copper plate won't fail during subsequent brazing or welding.
  • Dimensional Flatness & Surface Roughness: Vacuum chambers and semiconductor sputtering targets require exceptionally flat surfaces to maintain strict vacuum seals. Insist on precise surface milling options from the manufacturer.
  • Electrical Conductiveness Verification: Ensure plates undergo Eddy Current conductivity testing to prove compliance with IACS levels (minimum 100% IACS, ideally 101% IACS).

Sichuan Kepai provides complete physical and chemical documentation with every order. This ensures smooth passage through international customs and integration into strict defense and aerospace assemblies.

Technical Q&A: Oxygen Free Copper Plates

Detailed technical answers to common questions asked by engineers and procurement specialists.

Q1: What is the primary difference between C10100 (OFE) and C10200 (OF)?
A1: UNS C10100 (Oxygen-Free Electronic) is a high-purity variant requiring a minimum copper content of 99.99% and a maximum oxygen content of 0.0005% (5 ppm). UNS C10200 (Oxygen-Free) requires 99.95% copper and less than 0.001% oxygen (10 ppm). C10100 has a slightly higher electrical conductivity rating (101% IACS) and is selected for highly sensitive electronic and vacuum tube devices.
Q2: Why is oxygen-free copper preferred for vacuum applications?
A2: In ultra-high vacuum (UHV) systems, any volatile impurities within the chamber walls will outgas under thermal stress, degrading the vacuum. Oxygen-free copper contains minimal volatile impurities (such as zinc, phosphorus, lead, and sulfur), preventing outgassing and protecting vacuum stability.
Q3: How does oxygen-free copper prevent hydrogen embrittlement during welding?
A3: Standard copper (like ETP C11000) containing oxygen will form cuprous oxide. When welded or brazed in a hydrogen atmosphere, hydrogen diffuses into the copper and reacts with the cuprous oxide to form high-pressure steam. This steam forms micro-fissures at the grain boundaries, making the weld brittle. Because oxygen-free copper has virtually no internal oxygen, this reaction cannot occur, ensuring strong, ductile joints.
Q4: Can Kepai supply custom thicknesses and dimensions for copper plates?
A4: Yes. Our factory uses robust extrusion, rolling, and drawing machinery that allows us to customize plates, sheets, and bars to tight specifications. We regularly process plates from 5mm up to 100mm in thickness, with custom widths and lengths cut to match your exact CAD templates.
Q5: How does Sichuan Kepai verify the chemical composition of each batch?
A5: We have a dedicated Chemical Composition Testing Room. We perform optical emission spectrometry (OES) and inductively coupled plasma (ICP) testing to evaluate impurity parts per million (PPM). Additionally, every batch is checked using an eddy current conductance meter to verify electrical IACS conductivity before packaging.

GET STARTED TODAY

Partner with Sichuan Kepai New Material Co., Ltd. for Your Advanced Copper Alloy Needs.

Looking ahead, Sichuan Kepai New Materials Co., Ltd. will continue to uphold its original intention, with even greater enthusiasm and determination, to engage in research and application in the field of new materials, contributing to the development of the new copper alloy materials industry in China and globally. We look forward to working hand in hand with friends from all walks of life to create a brilliant future together!